Predictable copper sulphate for a predictable plating bath — high-purity grade for copper plating and PCB manufacturing.
Plating baths need a copper source that dissolves cleanly without introducing contamination.
Trace impurities — iron, chloride, organic residue — directly affect deposit quality and bath life.
Consistent purity keeps bath chemistry stable between top-ups, reducing re-qualification work.
New suppliers typically need to pass a technical qualification process before full adoption.
Manufactured with tighter impurity ceilings than standard industrial grade — built for bath-sensitive use.
Held to low limits on the specific impurities that affect plating deposit quality.
Fine to standard crystal for clean, predictable dissolution into the bath.
We supply trial quantities specifically for your technical qualification process.
Fe, Cl, and insoluble content are tested against plating-grade limits, not just standard-grade limits.
Sample dissolution is checked for clarity and residue before batch clearance.
COA formatted to support your internal supplier qualification documentation.
Send your current specification or COA — we'll match it to a grade, or explain exactly where and why ours differs. Trial quantities available for technical qualification runs.
